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congatec CPU un mikroshēmu dzesētāji Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.
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Vair.: 1

28 mm conga-HPC/cTLU Intel Tiger Lake-UP3
congatec HPC/cALP-CSA-HP-B
congatec CPU un mikroshēmu dzesētāji Standard active cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole. 1Ir noliktavā
Min.: 1
Vair.: 1
29 mm 12 VDC
congatec HPC/sILH-CSA-HP-T
congatec CPU un mikroshēmu dzesētāji Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.
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32.9 mm 12 VDC
congatec CPU un mikroshēmu dzesētāji Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Datu lapa
Nav noliktavā
Min.: 1
Vair.: 1
29 mm 12 VDC conga-HPC/cTLU Intel Tiger Lake-UP3
congatec CPU un mikroshēmu dzesētāji Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread.
Datu lapa
Nav noliktavā
Min.: 1
Vair.: 1
29 mm 12 VDC conga-HPC/cTLU Intel Tiger Lake-UP3
congatec CPU un mikroshēmu dzesētāji Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with M2.5mm thread.
Datu lapa
Nav noliktavā
Min.: 1
Vair.: 1
28 mm conga-HPC/cTLU Intel Tiger Lake-UP3
congatec CPU un mikroshēmu dzesētāji Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
Datu lapa
Nav noliktavā
Min.: 1
Vair.: 1
29 mm 12 VDC conga-HPC/cTLH Intel Tiger Lake-H
congatec CPU un mikroshēmu dzesētāji Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread.
Datu lapa
Nav noliktavā
Min.: 1
Vair.: 1
29 mm 12 VDC conga-HPC/cTLH Intel Tiger Lake-H
congatec CPU un mikroshēmu dzesētāji Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height. All standoffs are with 2.7mm bore hole.
Datu lapa
Nav noliktavā
Min.: 1
Vair.: 1
29 mm conga-HPC/cTLH Intel Tiger Lake-H
congatec CPU un mikroshēmu dzesētāji Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height. All standoffs are with M2.5mm thread.
Datu lapa
Nav noliktavā
Min.: 1
Vair.: 1
29 mm conga-HPC/cTLH Intel Tiger Lake-H
congatec HPC/cALP-CSA-HP-T
congatec CPU un mikroshēmu dzesētāji Standard active cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are M2.5mm threaded. Nav noliktavā
Min.: 1
Vair.: 1
29 mm 12 VDC
congatec HPC/cALP-CSP-HP-B
congatec CPU un mikroshēmu dzesētāji Standard passive cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 28.2mm height. All standoffs are with 2.7mm bore hole. Nav noliktavā
Min.: 1
Vair.: 1
28.2 mm
congatec HPC/cALP-CSP-HP-T
congatec CPU un mikroshēmu dzesētāji Standard passive cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 28.2mm height. All standoffs are M2.5mm threaded. Nav noliktavā
Min.: 1
Vair.: 1
28.2 mm
congatec HPC/cALS-CSA-HP-B
congatec CPU un mikroshēmu dzesētāji Standard active cooling solution for COM-HPC module conga-HPC/cALS with integrated heat pipes, 30mm height and two integrated 12V fans. All standoffs are with 2.7mm bore hole. Nav noliktavā
Min.: 1
Vair.: 1
30 mm 12 VDC
congatec HPC/cALS-CSA-HP-T
congatec CPU un mikroshēmu dzesētāji Standard active cooling solution for COM-HPC module conga-HPC/cALS with integrated heat pipes, 30mm height and two integrated 12V fans.. All standoffs are M2.5mm threaded. Nav noliktavā
Min.: 1
Vair.: 1
30 mm 12 VDC
congatec HPC/sILH-CSA-HP-B
congatec CPU un mikroshēmu dzesētāji Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs 2.7mm.
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32.9 mm 12 VDC
congatec HPC/sILL-CSA-HP
congatec CPU un mikroshēmu dzesētāji Standard active cooling solution for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes, 35.2mm overall cooling height and integrated 12V fan.
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35.2 mm 12 VDC
congatec HPC/sILL-CSP-HP
congatec CPU un mikroshēmu dzesētāji Standard passive cooling solution for COM-HPC Server modules conga-HPC/sILL with integrated heat pipes, 18.2mm overall cooling height.
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18.2 mm