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TE Connectivity SESD Series Silicon ESD Protection Devices

TE Connectivity SESD Series
Silicon ESD Protection Devices

TE Connectivity SESD Series Silicon ESD Protection Devices help protect electronic circuits against damage from Electrostatic Discharge (ESD), surge, and cable discharge events. These protection devices offer industry-leading low capacitance, low leakage current, and low clamping voltage in small size, low profile XDFN packages. TE Connectivity SESD Series Silicon ESD Protection Devices have an ESD maximum rating per IEC61000-4-2 standard of 20kV contact discharge and 20kV air discharge. They are ideal for applications including consumer, mobile, and portable electronics, tablet PC and external storage with high speed interfaces, and ultra-high speed data lines.

Part Number Datasheet Channels Capacitance Package
SESD0201X1BN-0010-098
1 channel 0.1pF 0201 (0603 metric)
SESD0402X1BN-0010-098 1 channel 0.1pF 0402 (1005 metric)
SESD0201X1UN-0020-090 1 channel 0.2pF 0201 (0603 metric)
SESD0402X1UN-0020-090 1 channel 0.2pF 0402 (1005 metric)
SESD0402Q2UG-0020-090 2 channels 0.2pF 0402 (1005 metric)
SESD0802Q4UG-0020-090 4 channels 0.2pF 0802
SESD1004Q4UG-0020-090 4 channels 0.2pF 1004
SESD1103Q6UG-0020-090 6 channels 0.2pF 1103

Features
  • Low capacitance
  • Low leakage current
  • Low clamping voltage
  • ESD ± 20kV contact & air discharge per IEC61000-4-2
  • Surge: 2A (max) @ (tp= 8x20μs) per IEC61000-4-2-5
  • Small size and low profile XDFN packages
Applications
  • Consumer, mobile, and portable electronics
  • Tablet PC and external storage with high speed interfaces
  • Ultra-high speed data lines
    • USB 3.0/2.0
    • HDMI 1.3/1.4: including support for 4K (Quad-HiDef Resolution)
    • DisplayPort interface
    • Thunderbolt interface
    • V-by-One HS
    • LVDS interface
  • Applications requiring high ESD performance in small DFN packages
Shared Benefits
  • Industry-leading lowest capacitance; provides lowest insertion loss for high speed data signals
  • Small size ESD protection diodes for high speed data signals (0201 size devices)
  • Helps protect electronic circuits against damage from Electrostatic Discharge (ESD), surge, and cable discharge events
  • Assists equipment to pass IEC61000-4-2, level 4 testing
Multi-Channel Benefits
  • Industry's smallest footprint and lowest profile multi-channel ESD array helps to optimize board space
  • Flow-through and single connection design helps routing PCB matched impedance high speed data lines
  • TE Connectivity
  • Circuit Protection
Publicēts: 0001-01-01 | Atjaunināts: 0001-01-01