ERM8 & ERF8 Edge Rate® Rugged High-Speed Strips

Samtec ERM8 and ERF8 Edge Rate® Rugged High-Speed Strips are 0.8mm pitch terminal and socket strips optimized for signal integrity performance. These strips feature a smooth broad milled contact surface for increased wear life. The ERM8 and ERF8 strips offer up to 200 positions with a stack height from 7mm to 16mm. These connectors are available in edge-mount and right-angle versions. The ERM8 rugged high-speed headers feature a hot-swap option and are designed for rugged micro-pitch applications. Samtec ERF8 rugged high-speed sockets improve "zippered" unmating with robust Edge Rate contacts. The ERM8 and ERF8 strips offer high-speed channel performance of up to 56Gbps.

Rezultāti: 2.266
Atlasīt Attēls Detaļas Nr. Raž. Apraksts Datu lapa Pieejamība Cenas noteikšana (EUR) Atlasiet rezultātus tabulā pēc vienības cenas, pamatojoties uz daudzumu. Daudz. RoHS ECAD modelis Produkts Pozīciju skaits Solis Rindu skaits Izvada veids Montāžas leņķis Krautnes augstums Strāvas parametri Sprieguma kategorija Maksimālais datu pārraides ātrums Minimālā darba temperatūra Maksimālā darba temperatūra Kontakta pārklājums Kontakta materiāls Korpusa materiāls Sērija Iepakojums
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Socket 474Ir noliktavā
Min.: 1
Vair.: 1
: 375

Sockets 140 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 7 mm, 8 mm, 10 mm, 13 mm, 14 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERF8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Terminal 548Ir noliktavā
Min.: 1
Vair.: 1
: 350

Headers 50 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 7 mm, 9 mm, 11 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERM8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Terminal 1.070Ir noliktavā
Min.: 1
Vair.: 1
: 325

Headers 26 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 10 mm, 12 mm, 14 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERM8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Terminal 401Ir noliktavā
Min.: 1
Vair.: 1
: 375

Headers 50 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 7 mm, 9 mm, 11 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERM8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Terminal 486Ir noliktavā
Min.: 1
Vair.: 1
: 250

Headers 120 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 10 mm, 12 mm, 14 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERM8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Socket 1.039Ir noliktavā
Min.: 1
Vair.: 1
: 150

Sockets 20 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERF8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Socket 2.026Ir noliktavā
Min.: 1
Vair.: 1
: 375

Sockets 20 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 9 mm, 10 mm, 12 mm, 15 mm, 16 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERF8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Socket 722Ir noliktavā
Min.: 1
Vair.: 1
: 500

Sockets 26 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 7 mm, 8 mm, 10 mm, 13 mm, 14 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERF8 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Socket 226Ir noliktavā
Min.: 1
Vair.: 1
: 225

Sockets 150 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERF8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Socket 524Ir noliktavā
Min.: 1
Vair.: 1
: 375

Sockets 150 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 7 mm, 8 mm, 10 mm, 13 mm, 14 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERF8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80MM EDGE RATE RUGGED SOCKET 1.385Ir noliktavā
Min.: 1
Vair.: 1
: 300

Sockets 50 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 9 mm, 10 mm, 12 mm, 15 mm, 16 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERF8 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Socket 1.035Ir noliktavā
Min.: 1
Vair.: 1
: 375

Sockets 140 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 7 mm, 8 mm, 10 mm, 13 mm, 14 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERF8 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Terminal 1.515Ir noliktavā
Min.: 1
Vair.: 1
: 325

Headers 10 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 10 mm, 12 mm, 14 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERM8 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Terminal 1.104Ir noliktavā
Min.: 1
Vair.: 1
: 200

Headers 20 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERM8 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Terminal 232Ir noliktavā
Min.: 1
Vair.: 1
: 200

Headers 100 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERM8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Socket 588Ir noliktavā
Min.: 1
Vair.: 1
: 300

Sockets 20 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 11 mm, 12 mm, 14 mm, 17 mm, 18 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERF8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Socket 407Ir noliktavā
Min.: 1
Vair.: 1
: 250

Sockets 40 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 11 mm, 12 mm, 14 mm, 17 mm, 18 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERF8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Socket 252Ir noliktavā
Min.: 1
Vair.: 1
: 375

Sockets 80 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 7 mm, 8 mm, 10 mm, 13 mm, 14 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERF8 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Socket 674Ir noliktavā
Min.: 1
Vair.: 1
: 300

Sockets 80 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 9 mm, 10 mm, 12 mm, 15 mm, 16 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERF8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Socket 285Ir noliktavā
Min.: 1
Vair.: 1
: 300

Sockets 150 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 9 mm, 10 mm, 12 mm, 15 mm, 16 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERF8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Terminal 744Ir noliktavā
Min.: 1
Vair.: 1
: 250

Headers 26 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 10 mm, 12 mm, 14 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERM8 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Terminal 279Ir noliktavā
Min.: 1
Vair.: 1
: 150

Headers 50 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 13 mm, 15 mm, 17 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERM8 Reel, Cut Tape, MouseReel
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Terminal 245Ir noliktavā
Min.: 1
Vair.: 1
: 250

Headers 80 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 10 mm, 12 mm, 14 mm 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERM8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Terminal 590Ir noliktavā
Min.: 1
Vair.: 1
: 200

Headers 120 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERM8 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.80 mm Edge Rate Rugged High Speed Terminal 200Ir noliktavā
Min.: 1
Vair.: 1
: 200

Headers 120 Position 0.8 mm (0.031 in) 2 Row Solder Right Angle 56 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) ERM8 Reel, Cut Tape