Murata LDB Chip Multilayer Hybrid Baluns
Murata LDB Chip Multilayer Hybrid Baluns are constructed with a copper conductor and ceramic material, making them ideal for high-frequency applications. These chip-type baluns offer low loss and 100Ω impedance at balanced terminals. They are SMD and come in a small package with a low profile. Murata LDB Chip Multilayer Hybrid Baluns are available in tape-and-reel packing for automatic mounting.
Features
- Constructed with a copper conductor and ceramic material
- Ideal for high-frequency applications
- 100Ω impedance at balanced terminals
- Small SMD size with a low profile
- Low loss
- Available in tape-and-reel packing for automatic mounting
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