Samtec ExaMAX® High-Speed Backplane System
Samtec ExaMAX® High-Speed Backplane System offers design flexibility to fit a variety of applications, including Flyover® cables supporting 112Gbps PAM4 and board-to-board connectors supporting 64Gbps PAM4. ExaMAX Backplane Systems are suitably designed for various industries, including 5G networking, medical, automotive, instrumentation, military/aerospace, and AI/machine learning.
112Gbps PAM4 Cable Assemblies
ExaMAX backplane cable systems improve routability and signal integrity using Samtec Flyover® technology, which routes the signal above a lossy PCB using co-extruded, ultra-low skew twinax for improved reach and bandwidth. The direct solder-attach-to-contacts optimizes the signal path, further enhancing performance. Supports 112Gbps PAM4 applications and is PCIe® 6.0/CXL™ 3.1 capable.
64Gbps PAM4 Interconnects
The Samtec ExaMAX contact system achieves two reliable points of contact at all times and minimizes residual stubs for improved signal integrity performance while providing low mating force and excellent contact normal force. The signal wafers incorporate a one-piece, embossed ground structure that improves crosstalk. Supports 64Gbps PAM4 (32Gbps NRZ) applications and is PICe 6.0/CXL 3.1 capable.
Features
- ExaMAX High-Speed Backplane System
- Meets a variety of industry specifications
- PCIe 6.0/CXL 3.1 capable
- 24 to 72 pair designs (4 and 6 pairs; 6, 8, 10, and 12 columns)
- Wafer design increases isolation for reduced crosstalk
- Press-fit tails provide a reliable electrical connection
- ExaMAX High-Speed Backplane Cable Assemblies
- 112Gbps PAM4 performance (cable-to-cable)
- PCIe 6.0/CXL 3.1 capable
- 34AWG and 30AWG Eye Speed® Ultra Low Skew Twinax Cable
- Improved signal integrity, increased flexibility, and routability
- Highly customizable with modular flexibility
- Reduce costs due to lower layer counts
- Multiple end options available
- EBTM, EBTM-RA, and EBTF-RA
- 2.00mm (.0787") pitch
- Supports 64Gbps PAM4 (32Gbps NRZ) applications
- PCIe 6.0/CXL 3.1 capable
- Available in pairs
- 4 pair: 6, 8, or 10 columns
- 6 pair: 6, 8, 10, or 12 columns
- Perpendicular or coplanar configurations
- EBDM-RA
- Eliminates the mid-plane improving airflow and requiring fewer connections
- 2.00mm (.0787") pitch
- 6 pairs per column
- Supports 64Gbps PAM4 (32Gbps NRZ) applications
- PCIe 6.0/CLX 3.1 capable
- Shorter signal path for improved signal integrity performance
- Integral guide post
- EBCM and EBCF
- 112Gbps PAM4 performance (cable-to-cable)
- 34AWG to 30AWG Twinax cable
- Increased isolation for reduced crosstalk
- Available in 4 or 6 pair (4, 6, 8, 10, 12, 14, or 16 columns)
- Vertical or right-angle configurations
- Intermateable with all ExaMAX connectors
- PCIe 6.0/CLX 3.1 capable
- EBCL
- Vertical latching shroud
- Provides retention for EBCF-VT to EBTM-VT
- Surrounds and protects EBTM-VT
- Screw mounts secure the EBCL to the board (M2 thread)
- EBCB
- Panel retention bracket
- Provides retention for EBCM
- Screw mounts secure the EBCB to the backplane
- EPTT and ETPS
- Power module for EBTF-RA and EBTM series
- Vertical or right-angle orientation
- EGBM and EGBF
- Vertical or right-angle orientation
- Guide module for EBTF-RA and EBTM series
Applications
- 5G networking
- Industrial
- Military/aerospace
- Test connectivity
- Medical
- Broadcast video
- Automotive
- AI/machine learning
- Instrumentation
Specifications
- 2.00mm pitch
- 4.2A current rating per pin
- Copper alloy contact material
- EBCM series mates with EBCF, EBTF, and EBCB
- EBCF series mates with EBCM, EBTM, and EBCL
- -55°C to +105°C operating temperature range
Catalog Pages
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