AcceleRate® HD Ultra-Dense Mezzanine Strips

Samtec AcceleRate® HD Ultra-Dense Mezzanine Strips feature a low-profile 5mm stack height, slim 5mm width, and a 0.635mm pitch. These micro interconnects are super dense with up to 400 total inputs/outputs (I/Os). The four-row design allows 10 to 100 positions per row. Samtec AcceleRate HD header and socket connectors are PCIe® 6.0/CXL® 3.2 capable, support 64Gbps PAM4 (32Gbps NRZ) applications, and feature an Edge Rate® contact system that is optimized for signal integrity performance. The open-pin-field design offers grounding and routing flexibility.

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Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Terminal
Datu lapa
658Ir noliktavā
Min.: 1
Vair.: 1
: 700
ADM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Terminal
Datu lapa
904Ir noliktavā
Min.: 1
Vair.: 1
: 900
ADM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Socket
Datu lapa
98Ir noliktavā
Min.: 1
Vair.: 1
: 100

Connectors 100 Position 0.635 mm (0.025 in) 4 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) ADF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Socket
Datu lapa
80Ir noliktavā
Min.: 1
Vair.: 1
: 400
Connectors 100 Position 0.635 mm (0.025 in) 4 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) ADF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Socket
Datu lapa
645Ir noliktavā
Min.: 1
Vair.: 1
: 900
ADF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Socket
Datu lapa
100Ir noliktavā
Min.: 1
Vair.: 1
: 400
ADF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Socket
Datu lapa
100Ir noliktavā
Min.: 1
Vair.: 1
: 400
Connectors 70 Position 0.635 mm (0.025 in) 4 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) ADF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Socket
Datu lapa
100Ir noliktavā
Min.: 1
Vair.: 1
: 400
Connectors 70 Position 0.635 mm (0.025 in) 4 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) ADF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Socket
Datu lapa
99Ir noliktavā
Min.: 1
Vair.: 1
: 400
Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) ADF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Socket
Datu lapa
95Ir noliktavā
Min.: 1
Vair.: 1
: 400
Connectors 80 Position 0.635 mm (0.025 in) 4 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) ADF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Socket
Datu lapa
150Ir noliktavā
Min.: 1
Vair.: 1
: 700
ADF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Socket
Datu lapa
100Ir noliktavā
Min.: 1
Vair.: 1
: 400
Connectors 90 Position 0.635 mm (0.025 in) 4 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) ADF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Socket
Datu lapa
100Ir noliktavā
Min.: 1
Vair.: 1
: 400
Connectors 90 Position 0.635 mm (0.025 in) 4 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) ADF6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Terminal
Datu lapa
302Ir noliktavā
Min.: 1
Vair.: 1
: 300

Connectors 100 Position 0.635 mm (0.025 in) 4 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) ADM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Terminal
Datu lapa
97Ir noliktavā
Min.: 1
Vair.: 1
: 300
Connectors 100 Position 0.635 mm (0.025 in) 4 Row Solder Straight Gold Copper Alloy Liquid Crystal Polymer (LCP) ADM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Terminal
Datu lapa
239Ir noliktavā
Min.: 1
Vair.: 1
: 875
ADM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Terminal
Datu lapa
899Ir noliktavā
1.300Paredzamais 10/19/2026
Min.: 1
Vair.: 1
: 650
Plugs 40 Position 0.635 mm (0.025 in) 4 Row Solder Balls Straight 4.9 mm 1.34 A 155 VAC, 219 VDC 64 Gbps - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) ADM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Terminal
Datu lapa
207Ir noliktavā
Min.: 1
Vair.: 1
: 650
ADM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Terminal
Datu lapa
363Ir noliktavā
Min.: 1
Vair.: 1
: 350
ADM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Terminal
Datu lapa
946Ir noliktavā
Min.: 1
Vair.: 1
: 675
ADM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Terminal
Datu lapa
250Ir noliktavā
Min.: 1
Vair.: 1
: 875
ADM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Terminal
Datu lapa
306Ir noliktavā
275Paredzamais 09/01/2026
Min.: 1
Vair.: 1
: 275
ADM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Terminal
Datu lapa
389Ir noliktavā
Min.: 1
Vair.: 1
: 275
ADM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Terminal
Datu lapa
312Ir noliktavā
Min.: 1
Vair.: 1
: 275
ADM6 Reel, Cut Tape
Samtec Board to Board un mezanīna savienotāji 0.635 mm AcceleRate HD High-Density 4-Row Terminal
Datu lapa
114Ir noliktavā
Min.: 1
Vair.: 1
: 275
ADM6 Reel, Cut Tape