Módulos multiprotocolo

Resultados: 1.632
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Qtde RoHS Modelo ECAD Série
Frequência
Potência de saída
Tipo de interface
Tensão de alimentação - Mín
Tensão de alimentação - Máx
Temperatura operacional mínima
Temperatura operacional máxima
Tipo de conector de antena
Dimensões
Protocolo - Bluetooth, BLE - 802.15.1
Protocolo - celular, NBIoT, LTE
Protocolo - GPS, GLONASS
Protocolo - Sub GHz
Protocolo - WiFi - 802.11
Protocolo - ANT, Thread, Zigbee - 802.15.4
Qualificação
Embalagem
Intel AX210.D2WG
Intel Módulos multiprotocolo Intel Wi-Fi 6E AX210 (Gig+), 1216, 2x2 AX R2 (6GHz)+BT, vPro
Ficha técnica
195Em estoque
4.000Esperado 08/20/2026
Mín.: 1
Mult.: 1

Wi-Fi 6 AX210 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 0 C + 80 C 12 mm x 16 mm x 1.67 mm Bluetooth 5.3 802.11 ax
Intel AX211.NGWG.NV
Intel Módulos multiprotocolo Intel Wi-Fi 6E AX211 (Gig+), 2230, 2x2 AX R2 (6GHz)+BT, No vPro
Ficha técnica
306Em estoque
Mín.: 1
Mult.: 1

Wi-Fi 6 AX211 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.3 802.11 ax
Telink Módulos multiprotocolo Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Ficha técnica
5Em estoque
Mín.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Telink Módulos multiprotocolo Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Ficha técnica
2Em estoque
Mín.: 1
Mult.: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
Silex Technology Módulos multiprotocolo [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f
Ficha técnica
10Em estoque
Mín.: 1
Mult.: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm Bulk
NXP Semiconductors IW611UK/A1IZ
NXP Semiconductors Módulos multiprotocolo IW611UK/A1I
Ficha técnica
25Em estoque
Mín.: 1
Mult.: 1
: 2.000

IW611HN Reel, Cut Tape
Telit Cinterion Módulos multiprotocolo 137Em estoque
180Esperado 01/14/2027
Mín.: 1
Mult.: 1

I2C, SPI, UART 3.4 V 4.2 V - 40 C + 85 C 28.2 mm x 28.2 mm x 2.2 mm Bluetooth LTE WiFi Tray
Microchip Technology Módulos multiprotocolo SMARTCONNECT WINC3400 WL MOD
Ficha técnica
767Em estoque
Mín.: 1
Mult.: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Microchip Technology Módulos multiprotocolo ATWINC3400 802.11 b/g/n + Bluetooth 5 Module Chip Antenna
Ficha técnica
130Em estoque
Mín.: 1
Mult.: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Silex Technology Módulos multiprotocolo [Sample Pack] Low power version SMT type 802.11ah SDIO Wi-Fi HaLow module using MM6108.
Ficha técnica
15Em estoque
Mín.: 1
Mult.: 1

23 dBm SPI - 40 C + 85 C MHF1 18 mm x 17 mm x 2.65 mm 802.11 ah Cut Tape
Pulse Electronics Módulos multiprotocolo USB 802.11 b/g/n BT module
746Em estoque
Mín.: 1
Mult.: 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
NXP Semiconductors IW612UK/A1IZ
NXP Semiconductors Módulos multiprotocolo IW612UK/A1I
Ficha técnica
25Em estoque
Mín.: 1
Mult.: 1
: 2.000

IW612HN Reel, Cut Tape
Intel Módulos multiprotocolo Intel Wi-Fi 6 AX201 (Gig+), 2230, 2x2 AX+BT, vPro
Ficha técnica
28Em estoque
Mín.: 1
Mult.: 1

AX201 2.4 GHz, 5 GHz Bluetooth, M.2, WiFi 0 C + 80 C 22 mm x 30 mm x 2.4 mm Bluetooth 5.2 802.11 ax


ADLINK Technology Módulos multiprotocolo AMPAK AP12356 WIFI/BT KIT 2x2 Wi-Fi + Bluetooth4.1 Module with PCI-e Half-Mini CardIEEE802.11a/b/g/n/ac, PCI-e interfaceOperating Temperature: -10 70? Driver for Win/Linux/Android2pcs x Antenna + 2pcs x IPEX cable 2Em estoque
Mín.: 1
Mult.: 1
2.4 GHz, 5 GHz 16 dBm PCIe, USB 3 V 3.6 V - 10 C + 70 C External Bluetooth 802.11 a/b/g/n/ac
AcSiP Módulos multiprotocolo AI7931LD - Módulos multiprotocolo WIFI6 Dual Band 2.4/5GHz M33 SoC Module
Ficha técnica
122Em estoque
Mín.: 1
Mult.: 1

WIFI 300 MHz ADC, GPIO, I2C, I2S, IR, PWM, SDIO, SPI, UART 2.97 V 3.63 V - 40 C + 85 C 32 mm x 32 mm x 2.7 mm Bluetooth 5.0 802.11 a/b/g/n/ac/ax Bag
Seeed Studio Módulos multiprotocolo The factory is currently not accepting orders for this product. 187Em estoque
Mín.: 1
Mult.: 1

2.4 GHz, 5 GHz USB 3.6 V 3.6 V u.FL 92 mm x 32 mm x 25 mm Bluetooth 5.0 802.11 b/g/n
Fortebit Módulos multiprotocolo Polaris 3G kit, includes: Polaris 3G board, aluminum case, GPS/Glonass/GSM antenna, main connector cable.
Ficha técnica
5Em estoque
Mín.: 1
Mult.: 1

800 MHz, 850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz, 2.1 GHz 33 dBm I2C, SPI, UART 8 V 36 V - 35 C + 80 C SMA 3G GSM GLONASS, GPS
DFRobot Módulos multiprotocolo ESP32-C3-WROOM-02-N4 Module (PCB antenna) 26Em estoque
Mín.: 1
Mult.: 1
2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB Bluetooth 5.0 802.11 b/g/n
NXP Semiconductors Módulos multiprotocolo IW610BUK/A1ZDI
Ficha técnica
25Em estoque
Mín.: 1
Mult.: 1
: 2.000

IW610BUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
Silicon Labs Módulos multiprotocolo Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
Ficha técnica
99Em estoque
Mín.: 1
Mult.: 1

MGM210L 2.4 GHz 12.5 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 105 C PCB 12.5 mm x 15.5 mm x 2.25 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Fortebit Módulos multiprotocolo Polaris 3G kit, includes: Polaris 3G board, aluminum case, GPS/Glonass/GSM antenna, main connector cable, LiPo battery.
Ficha técnica
1Em estoque
Mín.: 1
Mult.: 1

800 MHz, 850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz, 2.1 GHz 33 dBm I2C, SPI, UART 8 V 36 V - 35 C + 80 C SMA 3G GSM GLONASS, GPS
Crowd Supply Módulos multiprotocolo SuperB (built-in trace) by Macchina 27Em estoque
Mín.: 1
Mult.: 1
2.4 GHz 18.5 dBm GPIO, SPI, UART 2.7 V 3.6 V - 40 C + 65 C Built-In 26.2 mm x 25.5 mm x 7.8 mm Bluetooth 802.11 b/g/n
Adafruit Módulos multiprotocolo ESP32-C6-WROOM-1-N8 Engineering Module - 8 MB Quad SPI Flash - PCB Antenna 7Em estoque
Mín.: 1
Mult.: 1

Bulk
DFRobot Módulos multiprotocolo ESP32-C3-MINI-1-N4 Module (PCB antenna)
27Em estoque
Mín.: 1
Mult.: 1
2.4 GHz I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB Bluetooth 5.0 802.11 b/g/n
Intel Módulos multiprotocolo Intel Wi-Fi 6 AX200, 1216, 2x2 AX+BT, No vPro , LTE Coex, UART
Ficha técnica
480Em estoque
Mín.: 1
Mult.: 1

Wi-Fi 6 AX200 2.4 GHz, 5 GHz PCIe, USB 0 C + 80 C 12 mm x 16 mm x 1.65 mm Bluetooth 5.2 LTE 802.11 ax