Incoterms: DDP disponible a clientes en estados miembros de la UE. Todos los precios incluyen impuestos y tasas de aduanas en los métodos de envío seleccionados.
Incoterms: El DDU se aplica a la mayoría de los clientes de fuera de la UE. Los impuestos, tasas de aduana y tasas se recaudan en el momento de la entrega.
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Ordenadores en módulos (COM)
Computer-On-Modules are in stock with same-day shipping at Mouser from industry leading manufacturers. Mouser is an authorized distributor for many Computer-On-Module manufacturers including ADLINK, Advantech, congatec, Ka-Ro electronics, SECO & more.
Computer-On-Modules (COMs) are compact embedded computing platforms that integrate a processor, memory, and essential system functions into a standardized module designed to be paired with an application-specific carrier board. By consolidating complex computing resources into a pre-engineered solution, COMs help reduce development time, simplify hardware design, and accelerate product deployment while maintaining scalability and flexibility. These modules serve as a foundation for advanced embedded systems, enabling reliable processing, connectivity, and control across a wide range of industrial and commercial applications.
Types: The most common Computer-On-Module types include COM Express® modules, SMARC modules, Qseven modules, ETX modules, XTX modules, COM-HPC modules, ARM-based COMs, and x86-based COMs, each optimized for specific performance, power, expansion, and application requirements.
Applications: Computer-On-Modules are widely used in industrial automation systems, medical devices, transportation platforms, robotics, edge computing systems, machine vision equipment, communication infrastructure, digital signage, and Internet of Things (IoT) applications requiring scalable embedded computing capabilities.
Selection requirements: To choose Computer-On-Modules, evaluate processor architecture, computing performance, memory capacity, graphics capabilities, interface availability, power consumption, operating temperature range, lifecycle support, module standard compatibility, and suitability for the intended application and environmental conditions.
