.050" LP Array™ Low Profile High-Density Arrays

Samtec .050 LP Array™ Low Profile, Open-Pin-Field High-Density Arrays feature a dual beam contact system on a 1.27mm x 1.27mm (.050" x .050") pitch grid for maximum grounding and routing flexibility. The series is available in 4mm, 4.5mm, and 5mm mated heights with up to 320 total pins in 4-, 6- or 8-row configurations. These Samtec connectors support 28+ Gbps applications and are Final Inch® certified for Break Out Region trace routing recommendations to save time and be cost-effective. Standard lead-free solder crimp simplifies IR reflow terminations and improves solder joint reliability.

Visi rezultāti (252)

Atlasīt Attēls Detaļas Nr. Raž. Apraksts Datu lapa Pieejamība Cenas noteikšana (EUR) Atlasiet rezultātus tabulā pēc vienības cenas, pamatojoties uz daudzumu. Daudz. RoHS
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 730Ir noliktavā
Min.: 1
Vair.: 1
: 500

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 316Ir noliktavā
Min.: 1
Vair.: 1
: 350

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 447Ir noliktavā
Min.: 1
Vair.: 1
: 300

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 139Ir noliktavā
Min.: 1
Vair.: 1
: 300

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 324Ir noliktavā
Min.: 1
Vair.: 1
: 550

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 380Ir noliktavā
Min.: 1
Vair.: 1
: 300

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 168Ir noliktavā
Min.: 1
Vair.: 1
: 325

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 343Ir noliktavā
Min.: 1
Vair.: 1
: 300

Samtec Starplikas SUREWARE JACK SCREW 318Ir noliktavā
Min.: 1
Vair.: 1

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 390Ir noliktavā
Min.: 1
Vair.: 1
: 500

Samtec Starplikas SureWare Jack Screw Precision Board Stacking Standoff 333Ir noliktavā
Min.: 1
Vair.: 1
Samtec LPAM-30-01.0-S-06-1-K-TR
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 275Ir noliktavā
Min.: 1
Vair.: 1
: 325
Samtec Starplikas SUREWARE JACK SCREW 522Ir noliktavā
Min.: 1
Vair.: 1

Samtec Starplikas SUREWARE JACK SCREW 1.628Ir noliktavā
Min.: 1
Vair.: 1

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 1.110Ir noliktavā
Min.: 1
Vair.: 1
: 700

Samtec Board to Board un mezanīna savienotāji 1.27MM LP ARRAY HS HD ARRAY 288Ir noliktavā
Min.: 1
Vair.: 1
: 325
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 460Ir noliktavā
Min.: 1
Vair.: 1
: 550
Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 431Ir noliktavā
Min.: 1
Vair.: 1
: 550

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 517Ir noliktavā
Min.: 1
Vair.: 1
: 550

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 148Ir noliktavā
Min.: 1
Vair.: 1
: 500

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 459Ir noliktavā
Min.: 1
Vair.: 1
: 550

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 389Ir noliktavā
Min.: 1
Vair.: 1
: 350

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 75Ir noliktavā
Min.: 1
Vair.: 1
: 325

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 633Ir noliktavā
Min.: 1
Vair.: 1
: 625

Samtec Board to Board un mezanīna savienotāji .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array 203Ir noliktavā
Min.: 1
Vair.: 1
: 475